Power Loss and Junction Temperature Analysis in the Modular Multilevel Converters for HVDC Transmission Systems
Vol. 15, No. 3, pp. 685-694, May 2015
10.6113/JPE.2015.15.3.685
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Analytical model Conduction losses Insulated gate bipolar transistors (IGBT) Junction temperature Modular multilevel converters (MMC) Switching frequency Switching losses
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Cite this article
[IEEE Style]
H. Wang, G. Tang, Z. He, J. Cao, "Power Loss and Junction Temperature Analysis in the Modular Multilevel Converters for HVDC Transmission Systems," Journal of Power Electronics, vol. 15, no. 3, pp. 685-694, 2015. DOI: 10.6113/JPE.2015.15.3.685.
[ACM Style]
Haitian Wang, Guangfu Tang, Zhiyuan He, and Junzheng Cao. 2015. Power Loss and Junction Temperature Analysis in the Modular Multilevel Converters for HVDC Transmission Systems. Journal of Power Electronics, 15, 3, (2015), 685-694. DOI: 10.6113/JPE.2015.15.3.685.