Experimental Study on Conducted EMI Mitigation in SMPS using a Novel Spread Spectrum Technique

L. Premalatha; T. A. Raghavendiran; C. Ravichandran

Experimental Study on Conducted EMI Mitigation in SMPS using a Novel Spread Spectrum Technique

L. Premalatha

T. A. Raghavendiran

C. Ravichandran

Vol. 13, No. 4, pp. 619-625, Jul. 2013

10.6113/JPE.2013.13.4.619

Chaotic pulse position modulation

Chaotic pulse width modulation

EMC

EMI

External chaos generator

SMPS

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Abstract

Switched mode power supplies (SMPS) are power electronic circuits extensively used in a wide range of applications. High frequency switching operation of SMPS causes electromagnetic emissions and has the potential to interfere with system operation, which in turn has an impact on system performance. This makes electromagnetic compatibility (EMC) an important concern. In this paper, a new and simple spread spectrum technique is proposed by modulating chaotic pulse position modulation (CPPM) and pulse width modulation (PWM). The resulting CPWM is implemented to reduce the conducted EMI in SMPS. The proposed method is found to be effective in reducing conduction EMI. The effectiveness and simplicity of the proposed method on spreading those dominating frequencies is compared to the EMI mitigation technique using an external chaotic generator. Finally, the levels of conductive EMI with standard PWM, CPWM with an external chaos generator and the proposed method are experimentally verified to comply with the CISPR 22A regulations. The results confirm the effectiveness of the proposed method.

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Cite this article

[IEEE Style]

L. Premalatha, T. A. Raghavendiran, C. Ravichandran, "Experimental Study on Conducted EMI Mitigation in SMPS using a Novel Spread Spectrum Technique," Journal of Power Electronics, vol. 13, no. 4, pp. 619-625, 2013. DOI: 10.6113/JPE.2013.13.4.619.

[ACM Style]

L. Premalatha, T. A. Raghavendiran, and C. Ravichandran. 2013. Experimental Study on Conducted EMI Mitigation in SMPS using a Novel Spread Spectrum Technique. Journal of Power Electronics, 13, 4, (2013), 619-625. DOI: 10.6113/JPE.2013.13.4.619.