Optimization of an automotive power semiconductor switch module using inlay PCB technology

Chae-Won Kim; Han-Jin Do; Tae-Young Hwang; Shi-Hong Park

Optimization of an automotive power semiconductor switch module using inlay PCB technology

Vol. 21, No. 4, pp. 660-671, Apr. 2021

10.1007/s43236-020-00211-7

Automotive switch module

Abstract

An optimization approach for automotive power semiconductor switch module with shunt resistor using an inlay printed circuit board (PCB) is proposed in this study to analyze electrical and thermal characteristics under a given maximum temperature rise constraint. The final module with a shunt resistor and current measurement block is designed and manufactured by adopting the optimization results. The performance is measured and compared with a conventional module without a shunt resistor, which was manufactured before optimizing. The number of MOSFETs used in the module decreased from six to four while satisfying a maximum temperature rise of 20 °C. Therefore, optimization increases the price competitiveness of the power module.

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Cite this article

[IEEE Style]

C. Kim, H. Do, T. Hwang, S. Park, "Optimization of an automotive power semiconductor switch module using inlay PCB technology," Journal of Power Electronics, vol. 21, no. 4, pp. 660-671, 2021. DOI: 10.1007/s43236-020-00211-7.

[ACM Style]

Chae-Won Kim, Han-Jin Do, Tae-Young Hwang, and Shi-Hong Park. 2021. Optimization of an automotive power semiconductor switch module using inlay PCB technology. Journal of Power Electronics, 21, 4, (2021), 660-671. DOI: 10.1007/s43236-020-00211-7.