Junction temperature measurement method for IGBTs using turn‑on miller plateau duration
Vol. 21, No. 9, pp. 1374-1382, Sep. 2021
10.1007/s43236-021-00275-z
Abstract
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Cite this article
[IEEE Style]
C. Guo, S. Zhang, L. Wei, H. Li, S. Wang, K. Zhu, "Junction temperature measurement method for IGBTs using turn‑on miller plateau duration," Journal of Power Electronics, vol. 21, no. 9, pp. 1374-1382, 2021. DOI: 10.1007/s43236-021-00275-z.
[ACM Style]
Chunsheng Guo, Shiwei Zhang, Lei Wei, Hao Li, Sijin Wang, and Konggang Zhu. 2021. Junction temperature measurement method for IGBTs using turn‑on miller plateau duration. Journal of Power Electronics, 21, 9, (2021), 1374-1382. DOI: 10.1007/s43236-021-00275-z.