SOI radiation‑hardened 300 V half‑bridge date driver IC design with high dv/dt noise immunity
Vol. 23, No. 5, pp. 779-788, May 2023
10.1007/s43236-022-00570-3
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Cite this article
[IEEE Style]
Y. Gao, X. Cai, Z. Han, Y. Tang, L. Ding, R. Xia, M. Gao, F. Zhao, "SOI radiation‑hardened 300 V half‑bridge date driver IC design with high dv/dt noise immunity," Journal of Power Electronics, vol. 23, no. 5, pp. 779-788, 2023. DOI: 10.1007/s43236-022-00570-3.
[ACM Style]
Yuexin Gao, Xiaowu Cai, Zhengsheng Han, Yun Tang, Liqiang Ding, Ruirui Xia, Mali Gao, and Fazhan Zhao. 2023. SOI radiation‑hardened 300 V half‑bridge date driver IC design with high dv/dt noise immunity. Journal of Power Electronics, 23, 5, (2023), 779-788. DOI: 10.1007/s43236-022-00570-3.