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Analysis of perforated pin design use in automotive SiC power module heatsink
Sunghyun Pyun Seongmoo Cho Sang Won Yoon
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs
A Simple Method for Identifying Mechanical Parameters Based on Integral Calculation
Sang-Heon Han Anno Yoo Sang Won Yoon Young-Doo Yoon
Vol. 16, No. 4, pp. 1387-1395, Jul. 2016
10.6113/JPE.2016.16.4.1387
Vol. 16, No. 4, pp. 1387-1395, Jul. 2016
10.6113/JPE.2016.16.4.1387