Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bondin
Vol. 16, No. 5, pp. 1843-1850, Sep. 2016
10.6113/JPE.2016.16.5.1843
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Cite this article
[IEEE Style]
I. Suh, H. Jung, Y. Lee, S. Choa, "Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bondin," Journal of Power Electronics, vol. 16, no. 5, pp. 1843-1850, 2016. DOI: 10.6113/JPE.2016.16.5.1843.
[ACM Style]
Il-Woong Suh, Hoon-Sun Jung, Young-Ho Lee, and Sung-Hoon Choa. 2016. Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bondin. Journal of Power Electronics, 16, 5, (2016), 1843-1850. DOI: 10.6113/JPE.2016.16.5.1843.