MMC‑modified sub‑module structure with double reverse blocking IGBTs
Vol. 23, No. 3, pp. 434-444, Mar. 2023
10.1007/s43236-022-00550-7
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Modular multilevel converter Sub-module topology Device withstand voltage DC fault ride-through cost analysis
Abstract
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Cite this article
[IEEE Style]
Y. Liu, Z. Duan, Q. Chen, B. Li, M. Ban, Z. Li, "MMC‑modified sub‑module structure with double reverse blocking IGBTs," Journal of Power Electronics, vol. 23, no. 3, pp. 434-444, 2023. DOI: 10.1007/s43236-022-00550-7.
[ACM Style]
Yiqi Liu, Zhaoyu Duan, Qichao Chen, Bingkun Li, Mingfei Ban, and Zhenjie Li. 2023. MMC‑modified sub‑module structure with double reverse blocking IGBTs. Journal of Power Electronics, 23, 3, (2023), 434-444. DOI: 10.1007/s43236-022-00550-7.