Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs

Seongmoo Cho; Sang Won Yoon

Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs

Seongmoo Cho

Sang Won Yoon

Vol. 23, No. 12, pp. 1880-1887, Dec. 2023

10.1007/s43236-023-00708-x

Pin–fin structure

Heat Sink

Double-sided cooling module

Thermal Resistance

Pin shape

Abstract

This study proposes a modeling process for conveniently analyzing the thermal resistance of a double-sided cooling (DSC) power module used in automotive inverters. Conventionally, circular-shaped pin-fins are adopted in the heat sinks used in DSC modules. This study utilizes finite element method (FEM) simulation to estimate the junction-to-fluid thermal resistance and compares the simulation results with measured values. The modeling process achieves high accuracy, approximately 97%. The analysis involves an optimized design of the circular pin-fins, exploring parameters such as pin–fin spacing and diameter size. This optimization results in a sufficiently low device junction temperature while maintaining an acceptable pressure drop. Furthermore, the developed model is applied to two uncommon pin–fin shapes, cone and oval, and their performance is evaluated. The oval-shaped pin-fins reduce the device temperature by approximately 6.7%, from 156.2 to 145.7 ℃, with a slight increase in pressure drop from 2.18 to 2.92 kPa. However, this pressure drop is low enough to supply coolant to a xEV cooling system. These findings enhance the accuracy of thermal resistance analysis for DSC power modules and offer a costeffective means of estimating results without the need for direct manufacturing and measurement of pin–fin shape changes.

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Cite this article

[IEEE Style]

S. Cho and S. W. Yoon, "Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs," Journal of Power Electronics, vol. 23, no. 12, pp. 1880-1887, 2023. DOI: 10.1007/s43236-023-00708-x.

[ACM Style]

Seongmoo Cho and Sang Won Yoon. 2023. Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs. Journal of Power Electronics, 23, 12, (2023), 1880-1887. DOI: 10.1007/s43236-023-00708-x.