Analysis of perforated pin design use in automotive SiC power module heatsink

Sunghyun Pyun; Seongmoo Cho; Sang Won Yoon

Analysis of perforated pin design use in automotive SiC power module heatsink

Sunghyun Pyun

Seongmoo Cho

Sang Won Yoon

Vol. 23, No. 12, pp. 1888-1895, Dec. 2023

10.1007/s43236-023-00707-y

Abstract

This paper proposes the use of a perforated pin for a SiC power module heatsink in automotive applications. Both simulations and experiments demonstrate how the proposed new pin design can enhance cooling performance. We extensively investigate the shapes and locations of pin–fin structures, commonly used for power module cooling. However, due to limitations in geometrical optimization for improving cooling performance, we introduce a novel concept: the perforated pin. Ansys Fluent is utilized to conduct a preliminary analysis of the new pin design prior to prototyping and testing with a specially designed apparatus. Our proposed design is compared with three conventional alternatives: a standard cuboidal pin–fin (reference), a cuboidal pin–fin after geometric optimization, and cylindrical pin–fin cooling structures. The results reveal that the proposed design reduces the maximum device temperature while slightly increasing pressure loss. Notably, the pressure loss increment of our design is only 36.6% compared to the geometrically optimized cuboidal pin–fin, which exhibits a 151% increase in pressure loss alongside improved cooling performance.

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Cite this article

[IEEE Style]

S. Pyun, S. Cho, S. W. Yoon, "Analysis of perforated pin design use in automotive SiC power module heatsink," Journal of Power Electronics, vol. 23, no. 12, pp. 1888-1895, 2023. DOI: 10.1007/s43236-023-00707-y.

[ACM Style]

Sunghyun Pyun, Seongmoo Cho, and Sang Won Yoon. 2023. Analysis of perforated pin design use in automotive SiC power module heatsink. Journal of Power Electronics, 23, 12, (2023), 1888-1895. DOI: 10.1007/s43236-023-00707-y.