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DSP-Based Digital Controller for Multi-Phase Synchronous Buck Converters
Jung-Hoon Kim Jeong-Gyu Lim Se-Kyo Chung Yu-Jin Song
Vol. 9, No. 3, pp. 410-417, May 2009
10.6113/JPE.2009.9.3.410
Vol. 9, No. 3, pp. 410-417, May 2009
10.6113/JPE.2009.9.3.410
Power Module Bridge Type Auxiliary Resonant AC Link Snubber-Assisted Three-Phase Soft Switching Inverter
Hisashi Iyomori Shin-ichiro Nagai Masanobu Yoshida Eiji Hiraki Mutsuo Nakaoka
Vol. 4, No. 2, pp. 77-86, Apr. 2004
10.6113/JPE.2004.4.2.77
Vol. 4, No. 2, pp. 77-86, Apr. 2004
10.6113/JPE.2004.4.2.77
Novel P‑Hausdorff distance‑based fault diagnosis scheme for submodules in hybrid MMCs
Zixi Han Yiming Wu Zian Zeng Zijiang Wang Jianzhou Wu
Zongwu Huang Fali Tan Chenxuan Zhang Ben Shang Youping Fan
Vol. 24, No. 9, pp. 1462-1475, Sep. 2024
10.1007/s43236-024-00809-1
Zongwu Huang Fali Tan Chenxuan Zhang Ben Shang Youping Fan
Vol. 24, No. 9, pp. 1462-1475, Sep. 2024
10.1007/s43236-024-00809-1
Online monitoring method for submodule capacitors in modular multilevel converter based on cumulative sum detection of sliding window
Wei Lai Jinbao Zhang Dan Luo Hui Li Anbin Liu
Minyou Chen Hongjian Xia
Vol. 24, No. 6, pp. 964-977, Jun. 2024
10.1007/s43236-023-00760-7
Minyou Chen Hongjian Xia
Vol. 24, No. 6, pp. 964-977, Jun. 2024
10.1007/s43236-023-00760-7
Arm integrated double capacitor submodule for modular multilevel solid‑state transformers with DC short‑circuit fault ride‑through capability
Yinyu Yan Yichao Sun Wanxin Guo Hao Jiang Minqiang Hu
Vol. 24, No. 6, pp. 862-874, Jun. 2024
10.1007/s43236-024-00776-7
Vol. 24, No. 6, pp. 862-874, Jun. 2024
10.1007/s43236-024-00776-7
Stochastic PWM methods to inhibit junction temperature rise in IGBT module
Zihui Liu Jiaqing Ma Zhiqin He Qinmu Wu
Vol. 24, No. 4, pp. 565-572, Apr. 2024
10.1007/s43236-024-00778-5
Vol. 24, No. 4, pp. 565-572, Apr. 2024
10.1007/s43236-024-00778-5
Analysis of perforated pin design use in automotive SiC power module heatsink
Sunghyun Pyun Seongmoo Cho Sang Won Yoon
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs
Design and implementation of 1000 V 20 kW power module for electric vehicle fast charger
Gi-Young Lee Jun-Sung Park Su-Yeon Cho Wae-Gyeong Shin Jun-Ho Kim
Vol. 23, No. 10, pp. 1565-1575, Oct. 2023
10.1007/s43236-023-00691-3
Vol. 23, No. 10, pp. 1565-1575, Oct. 2023
10.1007/s43236-023-00691-3
Fault‑tolerant capability of MMC with novel structure of middle submodules
Duc Dung Le Dong-Choon Lee Eui-Cheol Nho
Vol. 23, No. 9, pp. 1342-1352, Sep. 2023
10.1007/s43236-023-00679-z
Vol. 23, No. 9, pp. 1342-1352, Sep. 2023
10.1007/s43236-023-00679-z