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Pressure Contact Interconnection for High Reliability Medium Power Integrated Power Electronic Modules
Xu Yang  Wenjie Chen  Xiaoyu He  Xiangjun Zeng  Zhaoan Wang

Vol. 9, No. 4, pp. 544-552, Jul. 2009
10.6113/JPE.2009.9.4.544
DSP-Based Digital Controller for Multi-Phase Synchronous Buck Converters
Jung-Hoon Kim  Jeong-Gyu Lim  Se-Kyo Chung  Yu-Jin Song
Vol. 9, No. 3, pp. 410-417, May  2009
10.6113/JPE.2009.9.3.410
Power Module Bridge Type Auxiliary Resonant AC Link Snubber-Assisted Three-Phase Soft Switching Inverter
Hisashi Iyomori  Shin-ichiro Nagai  Masanobu Yoshida  Eiji Hiraki  Mutsuo Nakaoka

Vol. 4, No. 2, pp. 77-86, Apr. 2004
10.6113/JPE.2004.4.2.77
WOA–PSO of fractional‑order PID control for arc plasma power supply inverter modules
Yue Li  Hailong Yu  Chuan Jiang  Yong Jin
Vol. 25, No. 2, pp. 382-392, Feb. 2025
10.1007/s43236-024-00891-5
Maximum power tracking algorithm for single photovoltaic module without position sensors
Yan Chen  Shunyang Ming  Hengbo Yu  Junli Meng  Jian Lin

Vol. 25, No. 2, pp. 370-381, Feb. 2025
10.1007/s43236-024-00894-2
Novel P‑Hausdorff distance‑based fault diagnosis scheme for submodules in hybrid MMCs
Zixi Han  Yiming Wu  Zian Zeng  Zijiang Wang  Jianzhou Wu 
Zongwu Huang  Fali Tan  Chenxuan Zhang  Ben Shang  Youping Fan

Vol. 24, No. 9, pp. 1462-1475, Sep. 2024
10.1007/s43236-024-00809-1
Online monitoring method for submodule capacitors in modular multilevel converter based on cumulative sum detection of sliding window
Wei Lai  Jinbao Zhang  Dan Luo  Hui Li  Anbin Liu 
Minyou Chen  Hongjian Xia
Vol. 24, No. 6, pp. 964-977, Jun. 2024
10.1007/s43236-023-00760-7
Arm integrated double capacitor submodule for modular multilevel solid‑state transformers with DC short‑circuit fault ride‑through capability
Yinyu Yan  Yichao Sun  Wanxin Guo  Hao Jiang  Minqiang Hu

Vol. 24, No. 6, pp. 862-874, Jun. 2024
10.1007/s43236-024-00776-7
Stochastic PWM methods to inhibit junction temperature rise in IGBT module
Zihui Liu  Jiaqing Ma  Zhiqin He  Qinmu Wu
Vol. 24, No. 4, pp. 565-572, Apr. 2024
10.1007/s43236-024-00778-5
Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs
Seongmoo Cho  Sang Won Yoon
Vol. 23, No. 12, pp. 1880-1887, Dec. 2023
10.1007/s43236-023-00708-x

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  ISSN : 1598 - 2092
eISSN : 2093 - 4718