Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules

Moez Ayadi; Sihem Bouguezzi; Moez Ghariani; Rafik Neji

Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules

Vol. 14, No. 6, pp. 1345-1356, Nov. 2014

10.6113/JPE.2014.14.6.1345

3D numerical simulation

Hybrid power module

Superposition method

Thermal influence measurement

Transient thermal impedance measurement

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Abstract

The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structureof these modules. An important consideration for high power and high frequency design is the spacing between semiconductordevices, substrate structure and influence of the boundary condition in the case. This study focuses on the thermal behavior of hybridpower modules to establish a simplified method that allows temperature estimation in different module components withoutdecapsulation. This study resulted in a correction of the junction temperature values estimated from the transient thermal impedanceof each component operating alone. The corrections depend on mutual thermal coupling between different chips of the hybridstructure. A new experimental technique for thermal mutual evaluation is presented. Notably, the classic analysis of thermalphenomena in these structures, which was independent of dissipated power magnitude and boundary conditions in the case, isincorrect.

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Cite this article

[IEEE Style]

M. Ayadi, S. Bouguezzi, M. Ghariani, R. Neji, "Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules," Journal of Power Electronics, vol. 14, no. 6, pp. 1345-1356, 2014. DOI: 10.6113/JPE.2014.14.6.1345.

[ACM Style]

Moez Ayadi, Sihem Bouguezzi, Moez Ghariani, and Rafik Neji. 2014. Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules. Journal of Power Electronics, 14, 6, (2014), 1345-1356. DOI: 10.6113/JPE.2014.14.6.1345.