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Experimental Investigations for Thermal Mutual Evaluation in Multi-Chip Modules
Moez Ayadi  Sihem Bouguezzi  Moez Ghariani  Rafik Neji
Vol. 14, No. 6, pp. 1345-1356, Nov. 2014
10.6113/JPE.2014.14.6.1345

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  ISSN : 1598 - 2092
eISSN : 2093 - 4718