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Analysis of perforated pin design use in automotive SiC power module heatsink
Sunghyun Pyun Seongmoo Cho Sang Won Yoon
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs
ISSN : 1598 - 2092
eISSN : 2093 - 4718