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Analysis of perforated pin design use in automotive SiC power module heatsink
Sunghyun Pyun Seongmoo Cho Sang Won Yoon
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023

Design and implementation of 1000 V 20 kW power module for electric vehicle fast charger
Gi-Young Lee Jun-Sung Park Su-Yeon Cho Wae-Gyeong Shin Jun-Ho Kim
Vol. 23, No. 10, pp. 1565-1575, Oct. 2023
10.1007/s43236-023-00691-3
Vol. 23, No. 10, pp. 1565-1575, Oct. 2023

Fault‑tolerant capability of MMC with novel structure of middle submodules
Duc Dung Le Dong-Choon Lee Eui-Cheol Nho
Vol. 23, No. 9, pp. 1342-1352, Sep. 2023
10.1007/s43236-023-00679-z
Vol. 23, No. 9, pp. 1342-1352, Sep. 2023

Low‑frequency suppression strategy based on MPC without common‑mode voltage increases
Lianqiang Wang Li Zhang Yongsheng Xiong
Vol. 23, No. 5, pp. 769-778, May 2023
10.1007/s43236-022-00584-x
Vol. 23, No. 5, pp. 769-778, May 2023

Wireless charging system for unmanned aerial vehicles using lightweight and compact receiver modules
Yuhong Tian Zhenjie Li Hao Liu Yiqi Liu Mingfei Ban
Junyuan Zheng
Vol. 23, No. 4, pp. 712-723, Apr. 2023
10.1007/s43236-022-00567-y
Junyuan Zheng
Vol. 23, No. 4, pp. 712-723, Apr. 2023

MMC‑modified sub‑module structure with double reverse blocking IGBTs
Yiqi Liu Zhaoyu Duan Qichao Chen Bingkun Li Mingfei Ban
Zhenjie Li
Vol. 23, No. 3, pp. 434-444, Mar. 2023
10.1007/s43236-022-00550-7
Zhenjie Li
Vol. 23, No. 3, pp. 434-444, Mar. 2023

Junction Temperature Estimation Approach Based on TSEPs in Multichip IGBT Modules
Jianxiong Yang Yanbo Che Li Ran Borong Hu Mingxing Du
Vol. 22, No. 9, pp. 1596-1605, Sep. 2022
10.1007/s43236-022-00465-3
Vol. 22, No. 9, pp. 1596-1605, Sep. 2022

Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions
Tong An Yanzhong Tian Fei Qin Yanwei Dai Yanpeng Gong
Pei Chen
Vol. 22, No. 9, pp. 1561-1575, Sep. 2022
10.1007/s43236-022-00449-3
Pei Chen
Vol. 22, No. 9, pp. 1561-1575, Sep. 2022

Practical power module implemented with bare dies on aluminum metal PCB substrate for AC‑to‑DC bridgeless dual‑boost power factor corrected rectifier
Low‑frequency suppression strategy based on predictive control model for modular multilevel converters
Lianqiang Wang Li Zhang Yongsheng Xiong Rui Ma
Vol. 21, No. 10, pp. 1407-1415, Oct. 2021
10.1007/s43236-021-00286-w
Vol. 21, No. 10, pp. 1407-1415, Oct. 2021
