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Stochastic PWM methods to inhibit junction temperature rise in IGBT module
Zihui Liu  Jiaqing Ma  Zhiqin He  Qinmu Wu
Vol. 24, No. 4, pp. 565-572, Apr. 2024
10.1007/s43236-024-00778-5
Analysis of perforated pin design use in automotive SiC power module heatsink
Sunghyun Pyun  Seongmoo Cho  Sang Won Yoon
Vol. 23, No. 12, pp. 1888-1895, Dec. 2023
10.1007/s43236-023-00707-y
Analysis model for thermal resistance of double‑sided cooling power module with pin–fin heat sink used in xEVs
Seongmoo Cho  Sang Won Yoon
Vol. 23, No. 12, pp. 1880-1887, Dec. 2023
10.1007/s43236-023-00708-x
Design and implementation of 1000 V 20 kW power module for electric vehicle fast charger
Gi-Young Lee  Jun-Sung Park  Su-Yeon Cho  Wae-Gyeong Shin  Jun-Ho Kim

Vol. 23, No. 10, pp. 1565-1575, Oct. 2023
10.1007/s43236-023-00691-3
Fault‑tolerant capability of MMC with novel structure of middle submodules
Duc Dung Le  Dong-Choon Lee  Eui-Cheol Nho
Vol. 23, No. 9, pp. 1342-1352, Sep. 2023
10.1007/s43236-023-00679-z
Low‑frequency suppression strategy based on MPC without common‑mode voltage increases
Lianqiang Wang  Li Zhang  Yongsheng Xiong
Vol. 23, No. 5, pp. 769-778, May  2023
10.1007/s43236-022-00584-x
Wireless charging system for unmanned aerial vehicles using lightweight and compact receiver modules
Yuhong Tian  Zhenjie Li  Hao Liu  Yiqi Liu  Mingfei Ban 
Junyuan Zheng
Vol. 23, No. 4, pp. 712-723, Apr. 2023
10.1007/s43236-022-00567-y
MMC‑modified sub‑module structure with double reverse blocking IGBTs
Yiqi Liu  Zhaoyu Duan  Qichao Chen  Bingkun Li  Mingfei Ban 
Zhenjie Li
Vol. 23, No. 3, pp. 434-444, Mar. 2023
10.1007/s43236-022-00550-7
Junction Temperature Estimation Approach Based on TSEPs in Multichip IGBT Modules
Jianxiong Yang  Yanbo Che  Li Ran  Borong Hu  Mingxing Du

Vol. 22, No. 9, pp. 1596-1605, Sep. 2022
10.1007/s43236-022-00465-3
Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions
Tong An  Yanzhong Tian  Fei Qin  Yanwei Dai  Yanpeng Gong 
Pei Chen
Vol. 22, No. 9, pp. 1561-1575, Sep. 2022
10.1007/s43236-022-00449-3

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  ISSN : 1598 - 2092
eISSN : 2093 - 4718