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Low‑frequency suppression strategy based on MPC without common‑mode voltage increases
Lianqiang Wang Li Zhang Yongsheng Xiong
Vol. 23, No. 5, pp. 769-778, May 2023
10.1007/s43236-022-00584-x
Vol. 23, No. 5, pp. 769-778, May 2023
10.1007/s43236-022-00584-x
Wireless charging system for unmanned aerial vehicles using lightweight and compact receiver modules
Yuhong Tian Zhenjie Li Hao Liu Yiqi Liu Mingfei Ban
Junyuan Zheng
Vol. 23, No. 4, pp. 712-723, Apr. 2023
10.1007/s43236-022-00567-y
Junyuan Zheng
Vol. 23, No. 4, pp. 712-723, Apr. 2023
10.1007/s43236-022-00567-y
MMC‑modified sub‑module structure with double reverse blocking IGBTs
Yiqi Liu Zhaoyu Duan Qichao Chen Bingkun Li Mingfei Ban
Zhenjie Li
Vol. 23, No. 3, pp. 434-444, Mar. 2023
10.1007/s43236-022-00550-7
Zhenjie Li
Vol. 23, No. 3, pp. 434-444, Mar. 2023
10.1007/s43236-022-00550-7
Junction Temperature Estimation Approach Based on TSEPs in Multichip IGBT Modules
Jianxiong Yang Yanbo Che Li Ran Borong Hu Mingxing Du
Vol. 22, No. 9, pp. 1596-1605, Sep. 2022
10.1007/s43236-022-00465-3
Vol. 22, No. 9, pp. 1596-1605, Sep. 2022
10.1007/s43236-022-00465-3
Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions
Tong An Yanzhong Tian Fei Qin Yanwei Dai Yanpeng Gong
Pei Chen
Vol. 22, No. 9, pp. 1561-1575, Sep. 2022
10.1007/s43236-022-00449-3
Pei Chen
Vol. 22, No. 9, pp. 1561-1575, Sep. 2022
10.1007/s43236-022-00449-3
Practical power module implemented with bare dies on aluminum metal PCB substrate for AC‑to‑DC bridgeless dual‑boost power factor corrected rectifier
Low‑frequency suppression strategy based on predictive control model for modular multilevel converters
Lianqiang Wang Li Zhang Yongsheng Xiong Rui Ma
Vol. 21, No. 10, pp. 1407-1415, Oct. 2021
10.1007/s43236-021-00286-w
Vol. 21, No. 10, pp. 1407-1415, Oct. 2021
10.1007/s43236-021-00286-w
Compound control strategy for maximum power point tracking with flexible step‑up converters for thin film photovoltaic module applications
Yuhang Liu Xiangxin Liu Jianwei Zhang Yufeng Zhang Guangchen Liu
Vol. 21, No. 9, pp. 1259-1269, Sep. 2021
10.1007/s43236-021-00269-x
Vol. 21, No. 9, pp. 1259-1269, Sep. 2021
10.1007/s43236-021-00269-x
Power electronic converter reliability and prognosis review focusing on power switch module failures
Ahmed Abuelnaga Mehdi Narimani Amir Sajjad Bahman
Vol. 21, No. 6, pp. 865-880, Jun. 2021
10.1007/s43236-021-00228-6
Vol. 21, No. 6, pp. 865-880, Jun. 2021
10.1007/s43236-021-00228-6
Optimization of an automotive power semiconductor switch module using inlay PCB technology
Chae-Won Kim Han-Jin Do Tae-Young Hwang Shi-Hong Park
Vol. 21, No. 4, pp. 660-671, Apr. 2021
10.1007/s43236-020-00211-7
Vol. 21, No. 4, pp. 660-671, Apr. 2021
10.1007/s43236-020-00211-7